The special phenolic resin does not release low molecular matter during the curing process, which improves the molding workability and product voidage, and the shrinkage rate during curing is almost zero. The properties of tensile modulus, tensile strength and elongation at break are better than those of phenolic resin and epoxy resin. Its dielectric constant varies little with wavelength, the concentration, toxicity and corrosiveness of combustion fumes are much lower, and it also has lower water absorption. In addition, special phenolic resin has great flexibility in molecular design, so different products with different structures can be acquired based on different raw materials.
Model |
Appearance |
Solid content@135℃（%） |
Viscosity@25℃（CP） |
Water（%） |
Gel time @210℃（S） |
Application & Performance |
WL-T850 |
Faint yellow to brownish red liquid |
75±2 |
200-400 |
≤1.0 |
280-500 |
All kinds of electronic insulation materials, copper clad plates, etc., light color |
WL-T851 |
75±2 |
200-400 |
≤1.0 |
280-500 |
All kinds of electronic insulating materials, copper clad plate, etc., good heat resistance |
WL-T860 |
69.0-71.0 |
150-300 |
≤1.0 |
300-450 |
All kinds of electronic insulating materials, copper clad plate, etc., good heat resistance |
WL-T870 |
62.0-64.0 |
50-150 |
≤1.0 |
240-360@175℃ |
All kinds of electronic insulating materials, copper clad plate, etc., good heat resistance |
WL-T872 |
69.0-71.0 |
150-350 |
≤1.0 |
150-240 |
All kinds of electronic insulating materials, copper clad plate, etc., fire retardant and good heat resistance |
WL-T880 |
69.0-71.0 |
150-300 |
≤1.0 |
600-900 |
All kinds of electronic insulating materials, copper-clad plates, etc., excellent adhesion and heat resistance |
WL-T890 |
|
69.0-71.0 |
120-200 |
≤1.0 |
400-650 |
All kinds of electronic insulating materials, copper-clad plates, etc., excellent adhesion and heat resistance |
Model |
Appearance |
Soften point（℃） |
Viscosity
@120℃（P） |
Volatile（%）（110℃3h） |
Gel time@210℃（S） |
Application & Performance |
WL-T170S |
Faint yellow to brownish red solid |
45-55 |
70-90（cp/60℃） |
≤3.0 |
160-260 |
All kinds of electronic insulation materials, copper clad plates, etc., low melting point, easy to process |
WL-T850S |
75-85 |
15-30 |
≤3.0 |
300-600 |
All kinds of electronic insulation materials, copper clad plates, etc., light color |
WL-T851S |
50-80 |
15-30 |
≤3.0 |
180-400 |
All kinds of electronic insulating materials, copper clad plate, etc., good heat resistance |
WL-T860S |
75-85 |
17-30 |
≤3.0 |
220-300 |
All kinds of electronic insulating materials, copper clad plate, etc., good heat resistance |
WL-T872S |
69-79 |
20-40 |
≤3.0 |
155-235 |
All kinds of electronic insulating materials, copper clad plate, etc., good heat resistance |
WL-T880S |
80-100 |
30-50 |
≤3.0 |
400-700 |
All kinds of electronic insulating materials, copper-clad plates, etc., excellent adhesion and heat resistance |
Packing: Liquid in 240Kg galvanized drum, or 1000Kg IBC. Powder resin in 20Kg valve bag or 25Kg kraft paper sack with a PE bag inside.
Storage: Store in dry, ventilated and cool place(≤20℃)， avoid direct sunshine, away from heat resource. Shelf life of resole is 3 months in winter, 1 month in summer (≤20℃). Shelf life of Powder resin if 6 months in winter, 3 months in summer (≤20℃).
